Process tube for manufacturing semiconductor wafers or the like



FIG. 1 is a front elevational view of the process tube for manufacturingsemiconductor wafers or the like, showing my new design;

FIG. 2 is a rear elevational view thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a right side elevational view thereof,

FIG. 6 is a left side elevational view thereof;

FIG. 7 is an enlarged cross-sectional view thereof taken along line 7—7in FIG. 3

FIG. 8 is an enlarged cross-sectional view thereof taken along line 8—8in FIG. 3

FIG. 9 is an enlarged cross-sectional view thereof taken along line 9—9in FIG. 3

FIG. 10 is a vertical cross-sectional view thereof taken along line10—10 in FIG. 3; and,

FIG. 11 is a bottom and right side perspective view thereof shown onreduced scale.

The broken line showing in the figures is for illustrative purposes onlyand forms no part of the claimed design.

The ornamental design for a process tube for manufacturing semiconductorwafers or the like, as shown and described.